Supermicro Mainboard X13SAQ, Mainboard Formfaktor: Micro-ATX, Anzahl Prozessorensockel: 1, Prozessorsockel: LGA 1700, Prozessorfamilie: Intel Core i7 (13xxx), Intel Core i3 (12xxx), Intel Core i5 (12xxx), Intel Core i3 (13xxx), Intel Core i5 (13xxx), Intel Core i7 (12xxx), Intel Core i9 (13xxx), Intel Core i9 (12xxx), Arbeitsspeicher Bauform: UDIMM

Manufacturer SUPERMICRO
Manufacturer# MBD-X13SAQ-O
Next possible delivery date: May 4, 2024
CHF 417.85
CHF 451.70 incl.
The X13SAQ motherboard supports an Intel 12th/13th Generation i3/i5/i7/i9, Pentium, and Celeron series processor in an LGA1700 socket with a thermal design power (TDP) of 125 W. Built with the Intel Q670E chipset, the motherboard supports up to 128GB Non-ECC DDR5 UDIMM memory with speeds of up to 4400 MT/s with one DIMM, or 4000 MT/s with two DIMM single rank, or 3600 MT/s with two DIMM dual rank. It features superior I/O expandability and high-speed connections, including one PCIe 5.0 x16 from the CPU, one PCIe 4.0 x4, one PCIe 3.0 x4, one PCIe 3.0 x2 from the PCH (open slots), M.2 M-key, eight SATA 3.0 ports, dual 2.5 GbE LAN ports, six COM ports, 8-bit GPIO, and an SMbus header. It also offers the most advanced data protection capability with a Trusted Platform Module (TPM) chip onboard. With a mainstream chipset plus ample expansion ports and support for four independent display interfaces, the motherboard is designed to meet the various needs of end customers in different situations.

Date added: 2023-06-07 08:50:50 / SID: 1831982 / DID: 1539605